上海矽锐电子科技有限公司
Shanghai Keenness Electronic Technology Co.,Ltd.

2244i

Description
Specification
Machine Model:        2244i
Lens Type (Resolution)  0.65 um
Lens NA 0.365
Lens Matching Ref 200 nm
Aperture Sizes 25.2 x 44 mm
Field Size  25.2 x 44 mm
Crossmask Size  150 um
Wafer Size  6 inch
Reticle Size  5x5 inch
Chamber Type, Power and Frequency Stainless UD 60 Please see the attached picture
Specs Test Results     
Description Specification
Lens Distortion < 200 nm
DOF 0.65 um ≧ 2 µm
CD Uniformity  £ 10 % 
Wafer plane irradiance 1000W (i-line) > 600 mW/cm2 
(Depend on machine condition) 
Exposure uniformity  £ 2 %
Throughput @ 100mJ/cm^2, 5 point EGA, 90% wafer coverage   > 80 WPH
Day 1 Day 2
EGA (WAS) alignment X  3 sigma < 150 nm
EGA (WAS) alignment Y  3 sigma < 150 nm
EGA (MVS) alignment X  No assigned  
EGA (MVS) alignment Y  No assigned  

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